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Antenna /

FPC

LDS

PCB

材料

外置天线

五金弹片

Cable Assembly

Antenna

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LDS+ NFC Antenna for Mobile Application

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规格:

Common resin materials as following:

PC (Polycarbonate)

Electroplating thickness as following:

Cu = 8+/-2 um

Ni = 3+/-1 um

(Au > 0.05 um options)

NFC Base Material:

PI Resin

Electroplating thickness:

Cu plating ≥ 0.5 OZ

Ni plating ≥ 1um

Au plating ≥ 0.03um

Adhesive:

3M/TESA/ Customized

Ferrite type:

Customized

Protective:

S/M, Coverlay

Black / Customized

产品特性:

High degree of design flexibility.

Ability to make products smaller by creating antenna structures on the enclosure.

Facilitates quick change of antenna layouts easily without expensive tooling changes.

resins available including popular PC, PC/ABS, ABS materials.

Offers cost-savings particularly for higher volume applications.