Common resin materials as following:
Electroplating thickness as following:
Cu = 8+/-2 um
Ni = 3+/-1 um
(Au > 0.05 um options)
Paint thickness as following:
High degree of design flexibility.
Ability to make products smaller by creating antenna structures on the enclosure.
Facilitates quick change of antenna layouts easily without expensive tooling changes.
Resins available including popular PC, PC/ABS, ABS materials.
Offers cost-savings particularly for higher volume applications.